34690-0202

Heilind Number:MOL34690-0202
Manufacturer:Molex
Manufacturer Number:34690-0202
Datasheet:RoHS Certificate of Compliance
ECAD Model:
3D Model

Description:

Stac64 Vertical Header Assembly, 20 Circuits, Polarization C, Brown, Tray

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 34690-0202
Color:Brown
Series:34690 - Stac64
Amperage:10 A
Connector Type:Stac64
Number of Contacts:20
Number of Rows:2
Termination Method:Through Hole
Contact Material:Brass
Body Orientation:Straight
Pitch:2.54 mm
Voltage:500 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Keying:No
Tail Length:3.33 mm
Operating Temperature Range:-40 - 100 °C
Contact Mating Area Plating:Tin
Number of Contacts Loaded:20
Mating Cycles:10
PCB Locator:Yes
PCB Retention:Without
Polarized to PCB:Yes
Polarized to Mate:Yes
PCB Thickness (Recommended):1.57 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:WAVE
Duration at Max. Process Temperature (seconds):040
Max. Cycles at Max. Process Temperature:003
Termination Pitch:2.54 mm
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:Yes
Stackable:No
Surface Mount Compatible:No
Breakaway:No
Make First / Break Last:No
Shroud Type:Yes
Part Aliases:0346900202
SKU:MOL34690-0202

Detailed Description

Easily enhance your PCB assembly with the Stac64 Vertical Header, featuring 20 circuits with Polarization C for secure connectivity. Crafted with durable High Temperature Thermoplastic and Tin-plated brass contacts, this header ensures reliable performance in various environments, with an amperage rating of 10A and voltage capability of 500V. Its through-hole termination method and straight body orientation offer easy installation, while the tray packaging provides convenience in handling. RoHS compliant and operating within a wide temperature range of -40 to 100°C, this header is a versatile choice for wire-to-board connections in demanding applications.