43045-2013

Heilind Number:MOL43045-2013
Manufacturer:Molex
Manufacturer Number:43045-2013
Datasheet:RoHS Certificate of Compliance
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 20 Circuits, with PCB Polarizing Peg, Gold, Glow-Wire Capable, Black

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 43045-2013
Color:Black
Series:43045
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:20
Number of Rows:2
Termination Method:Through Hole - Kinked Pin
Contact Material:Brass
Body Orientation:Straight
Pitch:3 mm
Voltage:600 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Number of Contacts Loaded:20
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:Yes
Mated Height:17.64 mm
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Material Flammability Standard:94V-0
Part Aliases:0430452013
SKU:MOL43045-2013

Detailed Description

Enhance your PCB connections with our Micro-Fit 3.0 Vertical Header. Featuring a 3.00mm pitch and a dual-row design, this connector ensures secure and efficient circuitry. With 20 gold-plated contacts, it offers reliable conductivity and is glow wire capable for added safety. The black high-temperature thermoplastic body, along with a straight orientation, guarantees durability in various operating conditions. Through-hole termination with kinked pins facilitates easy installation on 1.6mm thick PCBs, with polarizing pegs for proper orientation. RoHS compliant and lead-free, this connector is suitable for SMC and wave soldering processes, with a maximum temperature of 260°C. Trusted for its quality and performance, the Micro-Fit 3.0 is ideal for wire-to-board applications in a wide range of industries.