43650-0219
Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 2 Circuits, with PCB Press-fit Metal Retention Clip, Gold, Glow Wire Capable, Black
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 43650-0219 |
| Color: | Black |
| Series: | 43650 |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit 3.0 |
| Number of Contacts: | 2 |
| Number of Rows: | 1 |
| Termination Method: | Through Hole - Kinked Pin |
| Contact Material: | Brass |
| Body Orientation: | Straight |
| Pitch: | 3 mm |
| Voltage: | 600 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Number of Contacts Loaded: | 2 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Glow Wire Capable: | Yes |
| Mated Height: | 17.27 mm |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Shroud Type: | Fully |
| Product Name: | Micro-Fit 3.0 |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0436500219 |
| SKU: | MOL43650-0219 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/22/2024 | 515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales. |
Download |
| 06/07/2024 | 514961 - Packaging Method/Quantity Changing. We are implementing a packaging material change to enhance stability and temperature resistance. As a result, sample availability for packaging is not applicable. |
Download |