43650-0901

Heilind Number:MOL43650-0901
Manufacturer:Molex
Manufacturer Number:43650-0901
Datasheet:Packaging Specifications
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Single Row, 9 Circuits, with Snap-in Plastic Peg PCB Lock, Gold, Glow-Wire Capable, Black

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 43650-0901
Color:Black
Series:43650
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:9
Number of Rows:1
Termination Method:Through Hole
Contact Material:Brass
Body Orientation:Right Angle
Pitch:3 mm
Voltage:600 V
Material:High Temperature Thermoplastic
Orientation:Right Angle
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Number of Contacts Loaded:9
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:2.540 µm
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:Yes
Mated Height:6.98 mm
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Material Flammability Standard:94V-0
Part Aliases:0436500901
SKU:MOL43650-0901

Detailed Description

Elevate your PCB connectivity with our Micro-Fit 3.0 Right Angle Header, featuring a 3.00mm pitch and single row design. With nine gold-plated contacts and a robust brass construction, this connector ensures reliable power delivery at up to 600V and 8.5A. The snap-in plastic peg PCB lock guarantees secure installation, while the glow wire capable design offers enhanced safety. Perfect for high-temperature environments, the header is crafted from durable thermoplastic and operates flawlessly between -40 and 105°C. Its right angle orientation and through-hole termination method make it ideal for space-constrained applications, and with RoHS compliance, you can trust in its environmental friendliness. Upgrade your connectivity solution today with the Micro-Fit 3.0.