| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 44067-0201 |
| Color: | Black |
| Series: | 44067 |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit 3.0 |
| Number of Contacts: | 2 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Kinked Pin |
| Body Orientation: | Straight |
| Pitch: | 3 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Tail Length: | 4.01 mm |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Number of Contacts Loaded: | 2 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 3.6 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Termination Pitch: | 3 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Fully |
| Product Name: | Micro-Fit 3.0 |
| Part Aliases: | 0440670201 |
| SKU: | MOL44067-0201 |
44067-0201
| Heilind Number: | MOL44067-0201 |
| Manufacturer: | Molex |
| Manufacturer Number: | 44067-0201 |
| Datasheet: | Product Specification |
| ECAD Model: |
Description:
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 2 Circuits, Tin (Sn) Plating
More >>Specifications
Detailed Description
Enhance your PCB connections with our Micro-Fit 3.0 Wire-to-Board Header, designed for efficient power delivery in a compact form. This dual-row connector features a vertical orientation, perfect for accommodating up to 3.56mm thick PCBs. With 2 circuits and tin plating, it ensures reliable conductivity, rated for 8.5 A and 250 V. The through-hole termination method with kinked pins offers secure attachment, while the high-temperature thermoplastic construction guarantees durability in harsh environments. With features like PCB locator, retention, and polarization, installation is a breeze, meeting RoHS compliance for sustainability. Perfect for applications requiring robust PCB connectivity, our Micro-Fit 3.0 is your go-to solution for seamless integration.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 05/06/2015 | GCM 10664055 - Manufacturing Process Change. | Download | |||

