44067-0401

Heilind Number:MOL44067-0401
Manufacturer:Molex
Manufacturer Number:44067-0401
Datasheet:Drawing
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 4 Circuits, Tin (Sn) Plating

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 44067-0401
Color:Black
Series:44067
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:4
Number of Rows:2
Termination Method:Through Hole - Kinked Pin
Body Orientation:Straight
Pitch:3 mm
Voltage:250 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Keying:No
Tail Length:4.01 mm
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:2.54 µm
Number of Contacts Loaded:4
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:2.540 µm
PCB Thickness (Recommended):3.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Termination Pitch:3 mm
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:Yes
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Make First / Break Last:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Part Aliases:0440670401
SKU:MOL44067-0401

Detailed Description

Enhance your PCB connections with our Micro-Fit 3.0 Wire-to-Board Header. Designed for up to 3.56mm thick boards, this dual-row, vertically oriented header features four circuits for efficient power and signal transmission. With a high amperage rating of 8.5A and a voltage capacity of 250V, it ensures reliable performance in demanding applications. The through-hole termination method with kinked pins offers secure attachment, while the tin plating guarantees excellent conductivity. Operating in a wide temperature range from -40 to 105°C, this header is suitable for diverse environments. Its compact design, with a 3mm pitch and 4.01mm tail length, allows for space-efficient PCB layouts. RoHS compliant and lead-free solder capable, it aligns with modern environmental standards. Trust in the quality and durability of our Micro-Fit 3.0 Wire-to-Board Header for seamless and robust connectivity solutions.