| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 44067-0401 |
| Color: | Black |
| Series: | 44067 |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit 3.0 |
| Number of Contacts: | 4 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Kinked Pin |
| Body Orientation: | Straight |
| Pitch: | 3 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Tail Length: | 4.01 mm |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Number of Contacts Loaded: | 4 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 3.6 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Termination Pitch: | 3 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Fully |
| Product Name: | Micro-Fit 3.0 |
| Part Aliases: | 0440670401 |
| SKU: | MOL44067-0401 |
44067-0401
Specifications
Detailed Description
Enhance your PCB connections with our Micro-Fit 3.0 Wire-to-Board Header. Designed for up to 3.56mm thick boards, this dual-row, vertically oriented header features four circuits for efficient power and signal transmission. With a high amperage rating of 8.5A and a voltage capacity of 250V, it ensures reliable performance in demanding applications. The through-hole termination method with kinked pins offers secure attachment, while the tin plating guarantees excellent conductivity. Operating in a wide temperature range from -40 to 105°C, this header is suitable for diverse environments. Its compact design, with a 3mm pitch and 4.01mm tail length, allows for space-efficient PCB layouts. RoHS compliant and lead-free solder capable, it aligns with modern environmental standards. Trust in the quality and durability of our Micro-Fit 3.0 Wire-to-Board Header for seamless and robust connectivity solutions.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 01/24/2024 | 513543 - Equipment Transfer, Production Transfer or Rearrangement. Production Transfer Nogales recently increased their molding capacity by adding (2) additional 75 ton molding machines and now would like to shorten the supply chain by further reducing their dependency on other plants molding production. Nogales already has (5) Micro-fit 43045 housing molds of various ckt size that were transferred from Little Rock years ago and now would like to obtain the last (3) Micro-Fit 43045 molds from Lincoln for ckt size 4,8 &10. Once the transfer is finished, all 43045 molding housing production in AME region will be consolidated in Nogales plant 3105. It should be noted that Shanghai also molds these same components so the PCN should be limited to only those customers who's demand is filled by Nogales | Download | |||
| 05/06/2015 | GCM 10664055 - Manufacturing Process Change. | Download | |||

