44067-0601

Heilind Number:MOL44067-0601
Manufacturer:Molex
Manufacturer Number:44067-0601
Datasheet:Drawing
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 6 Circuits, Tin (Sn) Plating

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 44067-0601
Color:Black
Series:44067
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:6
Number of Rows:2
Termination Method:Through Hole - Kinked Pin
Body Orientation:Straight
Pitch:3 mm
Voltage:250 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Keying:No
Tail Length:4.01 mm
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:2.54 µm
Number of Contacts Loaded:6
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:2.540 µm
PCB Thickness (Recommended):3.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Termination Pitch:3 mm
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:Yes
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Make First / Break Last:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Part Aliases:0440670601
SKU:MOL44067-0601

Detailed Description

Enhance your PCB connections with our Micro-Fit 3.0 Wire-to-Board Header. Designed for seamless integration, this dual-row vertical header accommodates boards up to 3.56mm thick, offering reliability and durability in your electronic assemblies. With a 6-circuit configuration and tin plating, it ensures efficient power delivery, rated for up to 8.5A and 250V. The high-temperature thermoplastic construction guarantees performance in challenging environments, with an operating temperature range of -40 to 105°C. Featuring through-hole kinked pin termination and a straight body orientation, installation is straightforward, while the 3mm pitch allows for easy mating. RoHS compliant and lead-free process capable, this header aligns with modern environmental standards, making it a sustainable choice for your projects. Trust in the quality and performance of our Micro-Fit 3.0 Wire-to-Board Header for seamless connectivity in your applications.