| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 44067-0802 |
| Color: | Black |
| Series: | 44067 |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit 3.0 |
| Number of Contacts: | 8 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Kinked Pin |
| Body Orientation: | Straight |
| Pitch: | 3 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Tail Length: | 4.01 mm |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Number of Contacts Loaded: | 8 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 3.6 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Termination Pitch: | 3 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Fully |
| Product Name: | Micro-Fit 3.0 |
| Part Aliases: | 0440670802 |
| SKU: | MOL44067-0802 |
44067-0802
Specifications
Detailed Description
Enhance your electronic connections with our Micro-Fit 3.0 Wire-to-Board Header. This dual-row, vertical component is designed for PCBs up to 3.56mm thick, boasting 8 circuits for efficient power transmission. With a pitch of 3mm and a maximum amperage of 8.5A at 250V, it ensures reliable performance in various applications. The through-hole termination method with kinked pins offers secure attachment, while the high-temperature thermoplastic construction guarantees durability in challenging environments. Gold plating on the contact mating area ensures excellent conductivity, and with RoHS compliance, you can trust in its quality and sustainability. Perfect for wire-to-board connections, this header is an essential component for your PCB assembly projects. Elevate your designs with the Micro-Fit 3.0 Wire-to-Board Header.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 01/24/2024 | 513543 - Equipment Transfer, Production Transfer or Rearrangement. Production Transfer Nogales recently increased their molding capacity by adding (2) additional 75 ton molding machines and now would like to shorten the supply chain by further reducing their dependency on other plants molding production. Nogales already has (5) Micro-fit 43045 housing molds of various ckt size that were transferred from Little Rock years ago and now would like to obtain the last (3) Micro-Fit 43045 molds from Lincoln for ckt size 4,8 &10. Once the transfer is finished, all 43045 molding housing production in AME region will be consolidated in Nogales plant 3105. It should be noted that Shanghai also molds these same components so the PCN should be limited to only those customers who's demand is filled by Nogales | Download | |||
| 10/05/2022 | 512289 - Capacity Change/Tool Replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling | Download | |||

