| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 44067-1601 |
| Color: | Black |
| Series: | 44067 |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit 3.0 |
| Number of Contacts: | 16 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Kinked Pin |
| Body Orientation: | Straight |
| Pitch: | 3 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Tail Length: | 4.01 mm |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Number of Contacts Loaded: | 16 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 3.6 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Termination Pitch: | 3 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Fully |
| Product Name: | Micro-Fit 3.0 |
| Part Aliases: | 0440671601 |
| SKU: | MOL44067-1601 |
44067-1601
| Heilind Number: | MOL44067-1601 |
| Manufacturer: | Molex |
| Manufacturer Number: | 44067-1601 |
| Datasheet: | Product Specification |
| ECAD Model: |
Description:
Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 16 Circuits, Tin (Sn) Plating
More >>Specifications
Detailed Description
Enhance your PCB connectivity with the Micro-Fit 3.0 Wire-to-Board Header. Designed for efficiency, this dual-row header features a vertical orientation, perfect for up to 3.56mm thick PCBs. With 16 tin-plated circuits, it ensures reliable power delivery with an amperage rating of 8.5A and a voltage capacity of 250V. The high-temperature thermoplastic construction guarantees durability, even in harsh environments, while through-hole kinked pin termination offers secure attachment. Meeting RoHS compliance, this header is not only environmentally friendly but also easy to integrate into your assembly process with SMC and wave soldering capability. Whether for industrial or commercial applications, the Micro-Fit 3.0 is the ideal solution for your wire-to-board connection needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 05/06/2015 | GCM 10664055 - Manufacturing Process Change. | Download | |||

