44067-1601

Heilind Number:MOL44067-1601
Manufacturer:Molex
Manufacturer Number:44067-1601
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 16 Circuits, Tin (Sn) Plating

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 44067-1601
Color:Black
Series:44067
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:16
Number of Rows:2
Termination Method:Through Hole - Kinked Pin
Body Orientation:Straight
Pitch:3 mm
Voltage:250 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Keying:No
Tail Length:4.01 mm
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:2.54 µm
Number of Contacts Loaded:16
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:2.540 µm
PCB Thickness (Recommended):3.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Termination Pitch:3 mm
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:Yes
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Make First / Break Last:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Part Aliases:0440671601
SKU:MOL44067-1601

Detailed Description

Enhance your PCB connectivity with the Micro-Fit 3.0 Wire-to-Board Header. Designed for efficiency, this dual-row header features a vertical orientation, perfect for up to 3.56mm thick PCBs. With 16 tin-plated circuits, it ensures reliable power delivery with an amperage rating of 8.5A and a voltage capacity of 250V. The high-temperature thermoplastic construction guarantees durability, even in harsh environments, while through-hole kinked pin termination offers secure attachment. Meeting RoHS compliance, this header is not only environmentally friendly but also easy to integrate into your assembly process with SMC and wave soldering capability. Whether for industrial or commercial applications, the Micro-Fit 3.0 is the ideal solution for your wire-to-board connection needs.