44067-2001

Heilind Number:MOL44067-2001
Manufacturer:Molex
Manufacturer Number:44067-2001
Datasheet:RoHS Certificate of Compliance
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits, Tin (Sn) Plating

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 44067-2001
Color:Black
Series:44067
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:20
Number of Rows:2
Termination Method:Through Hole - Kinked Pin
Body Orientation:Straight
Pitch:3 mm
Voltage:250 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Keying:No
Tail Length:4.01 mm
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:2.54 µm
Number of Contacts Loaded:20
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:2.540 µm
PCB Thickness (Recommended):3.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Termination Pitch:3 mm
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:Yes
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Make First / Break Last:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Part Aliases:0440672001
SKU:MOL44067-2001

Detailed Description

Enhance your wire-to-board connections with our Micro-Fit 3.0 Header, featuring a dual-row design for efficient power delivery. With a vertical orientation suitable for up to 3.56mm thick PCBs, this connector ensures a secure fit. The 20 tin-plated circuits offer reliable conductivity, while the high-temperature thermoplastic construction guarantees durability in harsh environments. Rated for 8.5A and 250V, it meets stringent performance standards. The through-hole termination method with kinked pins simplifies installation, and PCB retention and polarization features further enhance stability. With RoHS compliance and lead-free soldering capability, it aligns with modern environmental standards. Perfect for various applications, this Micro-Fit 3.0 Header is a versatile and dependable choice for your connectivity needs.