44067-2402

Heilind Number:MOL44067-2402
Manufacturer:Molex
Manufacturer Number:44067-2402
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits, 0.38µm Gold (Au) Selective Plating

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 44067-2402
Color:Black
Series:44067
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:24
Number of Rows:2
Termination Method:Through Hole - Kinked Pin
Body Orientation:Straight
Pitch:3 mm
Voltage:250 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Keying:No
Tail Length:4.01 mm
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Number of Contacts Loaded:24
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:2.540 µm
PCB Thickness (Recommended):3.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Termination Pitch:3 mm
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:Yes
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Make First / Break Last:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Part Aliases:0440672402
SKU:MOL44067-2402

Detailed Description

Enhance your PCB connections with our Micro-Fit 3.0 Wire-to-Board Header. This dual-row, straight orientation header is designed for up to 3.56mm thick PCBs, offering reliable performance in various applications. With 24 gold-plated contacts, it ensures optimal conductivity and durability. Featuring through-hole termination with kinked pins, it facilitates secure and efficient soldering. Its high-temperature thermoplastic construction, along with a maximum operating temperature of 105°C, guarantees stability in demanding environments. RoHS compliant and lead-free process capable, this header aligns with modern environmental standards. Whether for industrial machinery or consumer electronics, trust in the Micro-Fit 3.0 for seamless and dependable wire-to-board connections.