46622-0400

Heilind Number:MOL46622-0400
Manufacturer:Molex
Manufacturer Number:46622-0400
Datasheet:Drawing
ECAD Model:
3D Model

Description:

Micro-Fit BMI Header, Surface Mount, Single Row, Right-Angle, with Solder Tab, Tin (Sn) Plating, 4 Circuits

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 46622-0400
Color:Black
Series:46622 - Micro-Fit BMI
Amperage:8.5 A
Connector Type:Micro-Fit BMI
Number of Contacts:4
Number of Rows:1
Termination Method:Surface Mount
Contact Material:Brass
Pitch:3 mm
Voltage:600 V
Material:Liquid Crystal Polymer
Orientation:Right Angle
Keying:No
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:1.524 µm
Number of Contacts Loaded:4
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:1.524 µm
Polarized to Mate:Yes
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:Yes
Stackable:No
Breakaway:No
Make First / Break Last:No
Shroud Type:Fully
Material Flammability Standard:94V-0
Part Aliases:0466220400
SKU:MOL46622-0400

Detailed Description

The Micro-Fit BMI SR RA SMT NAIL 6 SN 4CKT Connector in Black is a reliable solution for your wire-to-board connection needs. With a current rating of 8.5 A and a voltage rating of 600 V, it ensures efficient power transmission. Featuring a right-angle orientation and surface-mount termination method, it is suitable for various PCB designs. The contact material is brass with tin plating, meeting RoHS compliance. With PCB locator and retention features, it offers secure installation. Its high operating temperature range of -40 to 105 °C makes it suitable for a wide range of applications. Trust in the Micro-Fit BMI Connector for durable and high-performance connectivity.