47603-0001

MOL47603-0001
Heilind Number:MOL47603-0001
Manufacturer:Molex
Manufacturer Number:47603-0001
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

1.27mm Pitch SIM Card Holder with 2 Detect Pins, 8 Circuits, Push-Push Style, Housing Height 1.90mm, without Pegs, Lead-Free

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Specifications

AttributeValue
Product Category:
Memory Sockets & Connectors SIM, Micro-SIM & UIM Memory Card Connectors
Manufacturer:Molex
Manufacturer Part Number:Molex 47603-0001
Pitch:1.27 mm
Series:47603 - mini-SIM
Voltage:50 VDC
Amperage:.5 A
Material:High Temperature Thermoplastic
Shielded:Yes
PCB Locator:No
Mating Cycles:5000
PCB Retention:Yes
Connector Type:mini-SIM
Shell Material:Stainless Steel
Contact Plating:Gold Over Nickel
Contact Material:Copper Alloy
Housing Material:Thermoplastic
Number of Contacts:8
Termination Method:Surface Mount
Card Entry Location:Front
Card Detection Switch:Closed
Number of Contacts Loaded:8
Contact Mating Area Plating:Gold over Nickel
Contact Termination Plating:Gold
Operating Temperature Range:-20 - 70 °C
Duration at Max. Process Temperature (seconds):003
Lead Free Process Capability:REFLOW
Maximum Operating Temperature:70 °C
Minimum Operating Temperature:-20 °C
Contact Mating Area Plating Thickness:1.27 mm
Contact Termination Plating Thickness:1.27 mm
Max. Cycles at Max. Process Temperature:002
Maximum Solder Process Temperature:250 °C
SKU:MOL47603-0001

Detailed Description

Introducing our Mini-SIM Connector, part of the 47603 series. Designed for efficient surface mount installation, this connector features a durable thermoplastic housing and copper alloy contacts with gold plating for reliable connectivity. With a maximum operating temperature of 70°C and a voltage rating of 50V DC, it ensures performance in a wide range of applications. The high-temperature thermoplastic shell and stainless steel construction offer durability, while RoHS compliance guarantees environmental responsibility. Suitable for Memory Card applications, this connector is a versatile and dependable choice for your connectivity needs.