| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 500901-0801 |
| Series: | 500901 |
| Housing Material: | Thermoplastic |
| Mount Type: | Surface Mount |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold Over Nickel |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -25 °C |
| Pitch: | 1.1 mm |
| SKU: | MOL500901-0801.P |
500901-0801
Specifications
Detailed Description
Discover the perfect solution for seamless TransFlash Memory Card connectivity with our Cut Tape offering. Featuring a 1.10mm pitch and a hinge-type design, this connector ensures reliable performance in any application. Its round corner top adds a touch of versatility, while the housing crafted from durable thermoplastic guarantees long-lasting durability. With surface mount capabilities and copper alloy contacts plated with gold over nickel, you can trust in secure and efficient data transfer. Operating smoothly in temperatures ranging from -25°C to 85°C, this connector is not only high-performing but also environmentally friendly with RoHS compliance. Explore the possibilities with this essential component in the realm of memory card connectivity.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | Molex 10-89-7262 | 2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 26 Circuits, 0.38 |  |
 | Molex 172065-0002 | Mega-Fit Vertical Header, Through Hole, 5.70mm Pitch, Dual Row, 2 Circuits, 0.38 | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/01/2020 | 508305- Supplier Change. Plating component manufacturer: Molex Vietnam sub-contractor. final assembly finished good manufacturer: Molex Vietnam Plant. | Download | |||
| 03/28/2020 | 507651 - Supplier Change. Shell component now manufactured by supplier B Located Vietnam. | Download | |||
| 10/31/2019 | 506880 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different production location. No changes will be made to the product as a result of this move. | Download | |||
| 10/15/2019 | 507247 - Manufacturing Process Change (Molex). The manufacturing process for the part(s) identified in this notice are changing. No changes will be made to the product as a result of this process change. | Download | |||
| 09/15/2016 | 501413 - Equipment Transfer, Production Transfer or Rearrangement. | Download | |||
| 06/30/2014 | GCM 10638839 - New, Modified, Or Replacement Tooling. The purpose of this letter is to inform about new machine will be implemented in TFR card 500901080* production line in Molex Dalian.The reason of change is new capacity. We verified Impact of the change is the marking style will be changed, ink marking will be changed into laser marking.There is no impact to product quality & cost. please refer to attached file for implement date, method of identification and customer part. | Download | |||
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |