| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 503500-0991 |
| Series: | 503500 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold Over Nickel |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -25 °C |
| Pitch: | 2.5 mm |
| SKU: | MOL503500-0991.P |
503500-0991
Specifications
Detailed Description
Enhance your electronic devices with our advanced 2.50mm Pitch SD Memory Card Connector. Featuring a slim 2.95mm height and push-push mechanism, it ensures seamless card insertion and removal. Equipped with detect, protect, and anti-card-fly-out features, it guarantees secure and reliable connectivity. With surface mount termination and high-quality copper alloy contacts plated with gold over nickel, it offers optimal performance and durability. Operating efficiently in a wide temperature range from -25°C to 85°C, it is suitable for various applications. Rest assured, this connector is RoHS compliant, reflecting our commitment to environmental responsibility. Elevate your design with this essential component for memory sockets and connectors.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 50-57-9404 | SL Crimp Housing, Single Row, Version G, Positive Latch, 4 Circuits, Black | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download | |||
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download | |||
| 04/23/2020 | 507489 Packaging Change - This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include a new Delivery unit, packaging size, changes to the label or packaging material. | Download | |||
| 06/19/2018 | 505482 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. No changes will be made to the product as a result of this change. | Download | |||
| 09/15/2016 | 501417 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download | |||


