71308-6438

Heilind Number:MOL71308-6438
Manufacturer:Molex
Manufacturer Number:71308-6438
Datasheet:RoHS Certificate of Compliance
ECAD Model:
3D Model

Description:

2.54mm Pitch C-Grid Breakaway Header, Surface Mount, Dual Row, Vertical, 38 Circuits, 1.50µm Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm PCB Locator Pegs

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 71308-6438
Color:Black
Series:71308 - C-Grid
Amperage:3 A
Connector Type:C-Grid
Number of Contacts:38
Number of Rows:2
Termination Method:Surface Mount
Contact Material:Phosphor Bronze
Pitch:2.54 mm
Voltage:250 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Packaging:Tube
Contact Mating Area Plating:Tin
Number of Contacts Loaded:38
Mating Cycles:50
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:No
Connector System:Board to Board, Wire to Board
CSA Agency Certification:LR19980
UL Agency Certification:E29179
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Duration at Max. Process Temperature (seconds):040
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:No
Lock to Mating Part:No
Stackable:Yes
Breakaway:Yes
Shroud Type:No
Material Flammability Standard:94V-0
Part Aliases:0713086438
SKU:MOL71308-6438

Detailed Description

Easily connect components with this black C-Grid connector, part of the 71308 series. Featuring 38 contacts in a 2-row configuration, it offers a reliable amperage of 3A and a voltage rating of 250V. Designed for surface mount installation on PCBs, it ensures secure and efficient connectivity. Made of high-temperature thermoplastic with phosphor bronze contacts plated with tin, it guarantees durability and conductivity. With UL and CSA agency certifications, it meets industry standards for safety and performance. Ideal for board-to-board or wire-to-board applications, this connector is stackable and breakaway-compatible, offering flexibility in use. Its reflow-compatible lead-free termination and high solder process temperature make it suitable for various assembly processes. RoHS compliant and with a maximum mating cycle of 50, it ensures environmental responsibility and long-term reliability in electronic systems.