71979-0332

Heilind Number:MOL71979-0332
Manufacturer:Molex
Manufacturer Number:71979-0332
Datasheet:RoHS Certificate of Compliance
ECAD Model:
3D Model

Description:

2.54mm Pitch C-Grid Receptacle, Surface Mount, Dual Row, Right-Angle, 64 Circuits

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 71979-0332
Series:71979 - C-Grid
Amperage:1 A, 2 A, 3 A
Connector Type:C-Grid
Number of Contacts:64
Number of Rows:2
Termination Method:Surface Mount
Contact Material:Phosphor Bronze
Pitch:2.54 mm
Voltage:500 V AC
Material:High Temperature Thermoplastic
Orientation:Right Angle
Packaging:Tube
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:64
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:No
Contact Termination Plating Thickness:1.905 µm
PCB Thickness (Recommended):3.18 mm
Connector System:Board to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Duration at Max. Process Temperature (seconds):010
Max. Cycles at Max. Process Temperature:003
Termination Pitch:2.54 mm
Glow Wire Capable:No
Stackable:Yes
Part Aliases:0719790332
SKU:MOL71979-0332

Detailed Description

Elevate your PCB connectivity with our cutting-edge C-Grid Connector, part of the high-performance 71979 series. Designed for precision, it boasts an amperage range of 1-3A and features 64 contacts in a convenient 2-row configuration. With surface mount termination and gold plating, this connector ensures optimal signal transmission. Its robust construction, including phosphor bronze contacts and high-temperature thermoplastic housing, guarantees reliability in diverse applications. Offering a pitch of 2.54mm and compatibility with PCBs up to 3.18mm thick, it's perfect for seamless integration. RoHS compliant and lead-free process capable, it meets stringent environmental standards while delivering exceptional performance. Trust in this versatile connector for seamless board-to-board connectivity in various electronic systems.