73642-0200

Heilind Number:MOL73642-0200
Manufacturer:Molex
Manufacturer Number:73642-0200
Datasheet:Drawing
ECAD Model:
3D Model

Description:

HDM Board-to-Board Backplane Header, Vertical, Press-Fit, Open End, 72 Circuits

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 73642-0200
Color:Black, Natural
Series:73642 - HDM
Amperage:1 A
Connector Type:HDM
Number of Contacts:72
Number of Rows:6
Termination Method:Through Hole - Compliant Pin
Contact Material:Phosphor Bronze
Contact Plating:Gold
Maximum Operating Temperature:105 °C
Minimum Operating Temperature:-55 °C
Pitch:2 mm
Voltage:250 VAC
Material:High Temperature Thermoplastic
Orientation:Vertical
Keying:No
Component Type:PCB Header
Number of Pairs:Open Pin Field
Data Rate:1 Gb/s
Tail Length:3.5 mm
Packaging:Tube
Operating Temperature Range:-55 - 105 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:72
Mating Cycles:250
PCB Locator:No
Shielded:No
PCB Retention:Without
Polarized to PCB:No
Contact Termination Plating Thickness:.051 µm
PCB Thickness (Recommended):1.6 mm
Number of Columns:12
CSA Agency Certification:LR19980
UL Agency Certification:E29179
Contact Termination Plating:Gold
Termination Pitch:2 mm
Guide to Mating Part:No
Stackable:Yes
Surface Mount Compatible:Yes
Board to Board Configuration:Backplane
Make First / Break Last:No
Material Flammability Standard:94V-0
Part Aliases:0736420200
SKU:MOL73642-0200

Detailed Description

Enhance your board-to-board connections with our HDM Backplane Header, featuring a vertical, press-fit design for secure installation. This high-density connector boasts 72 circuits, arranged in six rows for efficient data transmission. With a durable construction, including phosphor bronze contacts plated in gold, it ensures reliable performance in a wide temperature range from -55°C to 105°C. Its 2mm pitch and 1A amperage rating make it suitable for various applications, while RoHS compliance guarantees environmental responsibility. Elevate your connectivity solutions with this essential component.