| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 73644-0205 |
| Color: | Black, Natural |
| Series: | 73644 - HDM |
| Amperage: | 1 A |
| Connector Type: | HDM |
| Number of Contacts: | 72 |
| Number of Rows: | 6 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | Phosphor Bronze, Stainless Steel |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 105 °C |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 2 mm |
| Voltage: | 250 VAC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | Yes |
| Component Type: | PCB Header |
| Number of Pairs: | Open Pin Field |
| Data Rate: | 1 Gb/s |
| Tail Length: | 3.5 mm |
| Operating Temperature Range: | -55 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 72 |
| Mating Cycles: | 250 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .051 µm |
| PCB Thickness (Recommended): | 2.5 mm |
| Number of Columns: | 12 |
| Contact Termination Plating: | Gold |
| Termination Pitch: | 2 mm |
| Guide to Mating Part: | Yes |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0736440205 |
| SKU: | MOL73644-0205 |
73644-0205
Specifications
Detailed Description
Enhance your board-to-board connections with our HDM Backplane Header, a vertical SMC connector featuring press-fit technology for secure installation. With 72 circuits arranged in 6 rows, this connector ensures reliable signal transmission in high-density applications. Constructed from durable materials and plated with gold for optimal conductivity, it operates flawlessly in temperatures ranging from -55°C to 105°C. Its 2mm pitch and 1Gb/s data rate capability make it ideal for high-speed communication systems. RoHS compliant and UL certified, this connector guarantees both performance and compliance with industry standards. Whether for telecommunications, industrial, or automotive applications, this Backplane Header is the perfect solution for your connectivity needs.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | Molex 73643-1200 | HDM Board-to-Board Backplane Header, Vertical, Press-Fit, Closed End, 144 Circuits |  |
 | Molex 73644-0209 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 72 Circuits | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/18/2025 | 516838 - Equipment Transfer, Production Transfer or Rearrangement. equipment transfer that have been used to manufacture impacted part(s). No changes will be made to product as part of this change. | Download | |||
| 12/30/2023 | 514258 - Change Supplier. This notification is to inform you this is a change regarding the supplier. Please refer to the details below. | Download | |||
| 09/20/2022 | 512191 - Packaging Method/Quantity Changing. Molex will replace the top locked cartons with normal standard cartons. Carton size / packaging quantity and packaging materials remain unchanged. No changes will be made to the part design and will not affect the use or disposal of inventory. | Download | |||
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download | |||
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download | |||
| 05/01/2021 | 509308 - Equipment Transfer, Production Transfer or Rearrangement. The purpose is to transfer the production line from current molex LRC factory US to Chengdu based factory. | Download | |||
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
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Factory Lead:
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 73644-0205 |
| Other Names: | 0736440205 |