| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 73644-1017 |
| Color: | Black, Natural |
| Series: | 73644 - HDM |
| Amperage: | 1 A |
| Connector Type: | HDM |
| Number of Contacts: | 144 |
| Number of Rows: | 6 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | Phosphor Bronze, Stainless Steel |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 105 °C |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 2 mm |
| Voltage: | 250 VAC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | Open Pin Field |
| Data Rate: | 1 Gb/s |
| Tail Length: | 3.5 mm |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 144 |
| Mating Cycles: | 250 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .051 µm |
| PCB Thickness (Recommended): | 2.5 mm |
| Number of Columns: | 24 |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Gold |
| Termination Pitch: | 2 mm |
| Guide to Mating Part: | Yes |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0736441017 |
| SKU: | MOL73644-1017 |
73644-1017
Specifications
Detailed Description
Enhance your backplane connections with our HDM Board-to-Board Backplane Header. Designed for vertical installation, this header features a durable SMC construction with press-fit termination for secure attachment. With 144 circuits spread across six rows, it offers ample connectivity for your application. The high-quality phosphor bronze and stainless steel contacts with gold plating ensure reliable signal transmission, while the 2mm pitch accommodates high-speed data transfer up to 1 Gb/s. Operating efficiently in temperatures ranging from -55 to 105 °C, this header is ideal for various industrial environments. Its compliant pin termination method and through-hole design guarantee a stable connection to your PCB, with added features like PCB retention and compatibility with 2.5mm thick boards for extra convenience. Certified for RoHS compliance and meeting stringent UL and CSA agency standards, this header is a trustworthy choice for your backplane connector needs. Elevate your connectivity solutions with this advanced HDM Board-to-Board Backplane Header.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/18/2025 | 516838 - Equipment Transfer, Production Transfer or Rearrangement. equipment transfer that have been used to manufacture impacted part(s). No changes will be made to product as part of this change. | Download | |||
| 12/30/2023 | 514258 - Change Supplier. This notification is to inform you this is a change regarding the supplier. Please refer to the details below. | Download | |||
| 09/20/2022 | 512191 - Packaging Method/Quantity Changing. Molex will replace the top locked cartons with normal standard cartons. Carton size / packaging quantity and packaging materials remain unchanged. No changes will be made to the part design and will not affect the use or disposal of inventory. | Download | |||
Availability
In Stock:
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Stock Location:
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Factory Stock:
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Unit Of Measure:
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Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 73644-1017 |
| Other Names: | 0736441017 |