| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 73650-0063 |
| Series: | 73650 |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 040 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Part Aliases: | 0736500063 |
| SKU: | MOL73650-0063 |
73650-0063
| Heilind Number: | MOL73650-0063 |
| Manufacturer: | Molex |
| Manufacturer Number: | 73650-0063 |
| Datasheet: | RoHS Certificate of Compliance |
| ECAD Model: |
Specifications
Detailed Description
This high-performance board-to-board connector offers reliable connectivity for your PCB applications. With a maximum solder process temperature of 260°C and lead-free process capability, it ensures compatibility with modern manufacturing standards. Designed for durability, it can withstand up to 40 seconds at the maximum solder temperature and remains operational through 3 cycles at this level. Compliant with RoHS regulations, it is environmentally friendly. Perfect for backplane connections, this connector guarantees secure and efficient data transmission in your electronic systems.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 09/20/2022 | 512191 - Packaging Method/Quantity Changing. Molex will replace the top locked cartons with normal standard cartons. Carton size / packaging quantity and packaging materials remain unchanged. No changes will be made to the part design and will not affect the use or disposal of inventory. | Download | |||

