73650-0078

Heilind Number:MOL73650-0078
Manufacturer:Molex
Manufacturer Number:73650-0078
Datasheet:Packaging Specifications
ECAD Model:
3D Model

Description:

HDM Bkpln Mod EndWall Opt 72Ckt

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 73650-0078
Series:73650
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Duration at Max. Process Temperature (seconds):040
Max. Cycles at Max. Process Temperature:003
Part Aliases:0736500078
SKU:MOL73650-0078

Detailed Description

Enhance your backplane connectivity with the HDM Bkpln Mod EndWall Opt 72Ckt. Designed for optimal performance, this end wall option offers 72 circuit points for seamless integration into your PCB setup. With a lead-free reflow process capability and RoHS compliance, it ensures environmental responsibility and quality soldering. Its durable construction can withstand a maximum solder process temperature of 260°C, with a duration of up to 40 seconds and a maximum of 3 cycles at this temperature. Perfect for high-speed data transmission and power delivery, this backplane connector is a reliable choice for your connectivity needs.