| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 73650-0182 |
| Series: | 73650 |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Part Aliases: | 0736500182 |
| SKU: | MOL73650-0182 |
73650-0182
| Heilind Number: | MOL73650-0182 |
| Manufacturer: | Molex |
| Manufacturer Number: | 73650-0182 |
| Datasheet: | Packaging Specifications |
| ECAD Model: | |
Specifications
Detailed Description
Enhance your connectivity with our custom backplane assembly, meticulously designed for seamless integration in high-density applications. Featuring 72 circuit points, this essential component ensures reliable communication between PCBs. Crafted with precision and durability in mind, it guarantees optimal performance even in demanding environments. With RoHS compliance and lead-free process capability, it meets the highest standards of environmental responsibility. Trust in the quality and efficiency of this backplane assembly for your connectivity needs.
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 73650-0182 |
| Other Names: | 0736500182 |