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Enhance your high-density modular connector systems with our HDM Cus BP Pol/Gde Opt 144Pos series. Designed for seamless board-to-board connections, these connectors offer optimal performance and reliability. With a lead-free process capability and RoHS compliance, they are environmentally friendly and suitable for a range of applications. The maximum solder process temperature of 260 °C ensures secure assembly, while the durable construction guarantees long-lasting functionality. Upgrade your backplane connectors with this essential component for efficient and seamless connectivity.