73650-0207

Heilind Number:MOL73650-0207
Manufacturer:Molex
Manufacturer Number:73650-0207
Datasheet:Application Specification
ECAD Model:
3D Model

Description:

HDM Custom Backplane Assembly

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 73650-0207
Series:73650
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Part Aliases:0736500207
SKU:MOL73650-0207

Detailed Description

Elevate your hardware setup with our cutting-edge HDM Custom Backplane Assembly. Engineered for seamless connectivity, this high-performance component boasts a lead-free process capability and RoHS compliance, making it an environmentally conscious choice. With a maximum solder process temperature of 260°C, it guarantees durability and stability under extreme conditions. Part of our exclusive 73650 series, it is designed to meet the most stringent industry standards, ensuring optimal performance in any application. Upgrade your system with this essential connector for enhanced functionality and reliability.