Elevate your hardware setup with our cutting-edge HDM Custom Backplane Assembly. Engineered for seamless connectivity, this high-performance component boasts a lead-free process capability and RoHS compliance, making it an environmentally conscious choice. With a maximum solder process temperature of 260°C, it guarantees durability and stability under extreme conditions. Part of our exclusive 73650 series, it is designed to meet the most stringent industry standards, ensuring optimal performance in any application. Upgrade your system with this essential connector for enhanced functionality and reliability.