73650-0228

Heilind Number:MOL73650-0228
Manufacturer:Molex
Manufacturer Number:73650-0228
Datasheet:Application Specification
ECAD Model:
3D Model

Description:

HDM Custom Backplane 144 Pos P/G Assy

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 73650-0228
Series:73650
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Duration at Max. Process Temperature (seconds):040
Max. Cycles at Max. Process Temperature:003
Part Aliases:0736500228
SKU:MOL73650-0228

Detailed Description

Enhance your connectivity with the HDM Custom Backplane 144 Pos P/G Assy. This high-density backplane connector offers seamless integration for your PCB setups, ensuring reliable signal transmission. With a lead-free process capability and RoHS compliance, it meets stringent environmental standards. Designed for durability, it can withstand a maximum solder process temperature of 260°C and up to 3 cycles at this temperature, making it ideal for high-volume production. Elevate your board-to-board connections with this essential component.