| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 73650-0232 |
| Series: | 73650 |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 040 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Part Aliases: | 0736500232 |
| SKU: | MOL73650-0232 |
73650-0232
| Heilind Number: | MOL73650-0232 |
| Manufacturer: | Molex |
| Manufacturer Number: | 73650-0232 |
| Datasheet: | Application Specification |
| ECAD Model: | |
Specifications
Detailed Description
Upgrade your connectivity with our HDM Custom Backplane Assembly. Designed for seamless integration, this assembly boasts high durability and reliability, making it ideal for demanding industrial environments. With a lead-free process capability and RoHS compliance, you can trust in its environmentally friendly construction. Experience effortless installation and superior performance with this essential component in the world of PCB connectors.
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 73650-0232 |
| Other Names: | 0736500232 |