| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 73656-0000 |
| Color: | Black |
| Series: | 73656 - HDM |
| Amperage: | 15 A |
| Connector Type: | HDM |
| Number of Contacts: | 3 |
| Number of Rows: | 3 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 105 °C |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 3.7 mm |
| Voltage: | 500 V AC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Component Type: | Power Header |
| Number of Pairs: | Open Pin Field |
| Data Rate: | 1 Gb/s |
| Tail Length: | 3.5 mm |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 3 |
| Mating Cycles: | 250 |
| PCB Locator: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .051 µm |
| PCB Thickness (Recommended): | 2.5 mm |
| Number of Columns: | 1 |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Gold |
| Termination Pitch: | 2 mm |
| Guide to Mating Part: | No |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0736560000 |
| SKU: | MOL73656-0000 |
73656-0000
| Heilind Number: | MOL73656-0000 |
| Manufacturer: | Molex |
| Manufacturer Number: | 73656-0000 |
| Datasheet: | Application Specification |
| ECAD Model: |
Description:
HDM Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 3 Circuits, Gold (Au) 0.76
More >>Specifications
Detailed Description
Power up your board-to-board connections with our HDM Backplane Power Module. Featuring a vertical orientation and SMC design, this module is crafted for seamless power transmission in electronic systems. With a robust construction of high temperature thermoplastic, it ensures durability in various operating conditions. The three gold-plated circuits offer reliable connectivity, while the beryllium copper contacts guarantee efficient power transfer. Suitable for high-speed data transmission with a data rate of 1 Gb/s, this module is a versatile solution for your connectivity needs. RoHS compliant and UL certified, it meets stringent quality standards for your peace of mind. Elevate your backplane connections with this essential component.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/18/2025 | 516838 - Equipment Transfer, Production Transfer or Rearrangement. equipment transfer that have been used to manufacture impacted part(s). No changes will be made to product as part of this change. | Download | |||
| 09/20/2022 | 512191 - Packaging Method/Quantity Changing. Molex will replace the top locked cartons with normal standard cartons. Carton size / packaging quantity and packaging materials remain unchanged. No changes will be made to the part design and will not affect the use or disposal of inventory. | Download | |||
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download | |||
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download | |||
| 05/01/2021 | 509308 - Equipment Transfer, Production Transfer or Rearrangement. The purpose is to transfer the production line from current molex LRC factory US to Chengdu based factory. | Download | |||

