| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 73771-1190 |
| Color: | Black |
| Series: | 73771 - HDM |
| Amperage: | 1 A |
| Connector Type: | HDM |
| Number of Contacts: | 144 |
| Number of Rows: | 6 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | Phosphor Bronze, Stainless Steel |
| Pitch: | 2 mm |
| Voltage: | 250 VAC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | Yes |
| Component Type: | PCB Header |
| Number of Pairs: | Open Pin Field |
| Data Rate: | 1 Gb/s |
| Tail Length: | 3.5 mm |
| Packaging: | Tube |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 144 |
| Mating Cycles: | 250 |
| PCB Locator: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .381 µm |
| PCB Thickness (Recommended): | 2.5 mm |
| Number of Columns: | 24 |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin-Lead |
| Guide to Mating Part: | Yes |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Midplane |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0737711190 |
| SKU: | MOL73771-1190 |
73771-1190
| Heilind Number: | MOL73771-1190 |
| Manufacturer: | Molex |
| Manufacturer Number: | 73771-1190 |
| Datasheet: | Packaging Specifications |
| ECAD Model: |
Description:
HDM Board-to-Board Stacking Header, High Rise Vertical, SMC, Press-Fit, Guide Pin Option, Keying Option A, 144 Circuits, Stack Height 15.05mm
More >>Specifications
Detailed Description
Enhance your board-to-board connectivity with our HDM Stacking Header, designed for high-rise vertical applications. This SMC connector features a press-fit installation method, with options for guide pins and keying for secure mating. Boasting 144 circuits and a stack height of 15.05mm, it ensures reliable signal transmission. Constructed with high-temperature thermoplastic and gold-plated contacts, it offers durability and high performance. With a pitch of 2mm and a data rate of 1 Gb/s, it supports high-speed applications. RoHS compliant and featuring UL and CSA certifications, it meets stringent quality standards. Perfect for backplane and midplane configurations, this connector is essential for your PCB assembly needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 10/31/2024 | 514359 - Obsolete. No replacement, LTB 6/27/24 LTS 9/27/24 | Download | |||
| 12/30/2023 | 514258 - Change Supplier. This notification is to inform you this is a change regarding the supplier. Please refer to the details below. | Download | |||
| 09/20/2022 | 512191 - Packaging Method/Quantity Changing. Molex will replace the top locked cartons with normal standard cartons. Carton size / packaging quantity and packaging materials remain unchanged. No changes will be made to the part design and will not affect the use or disposal of inventory. | Download | |||
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download | |||
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download | |||
| 05/01/2021 | 509308 - Equipment Transfer, Production Transfer or Rearrangement. The purpose is to transfer the production line from current molex LRC factory US to Chengdu based factory. | Download | |||

