| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 73782-7200 |
| Color: | Black |
| Series: | 73782 - HDM |
| Amperage: | 1 A |
| Connector Type: | HDM |
| Number of Contacts: | 144 |
| Number of Rows: | 6 |
| Termination Method: | Through Hole |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 105 °C |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 2 mm |
| Voltage: | 100 V AC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | Open Pin Field |
| Data Rate: | 1 Gb/s |
| Tail Length: | 3.5 mm |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 144 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 1.4 mm |
| Number of Columns: | 24 |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin-Lead |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Guide to Mating Part: | No |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane, Mezzanine |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0737827200 |
| SKU: | MOL73782-7200 |
73782-7200
| Heilind Number: | MOL73782-7200 |
| Manufacturer: | Molex |
| Manufacturer Number: | 73782-7200 |
| Datasheet: | RoHS Certificate of Compliance |
| ECAD Model: |
Description:
HDM Board-to-Board Stacking Header, High Rise Vertical, SMC, Closed End Option, 144 Circuits
More >>Specifications
Detailed Description
Enhance your board-to-board connections with our HDM Stacking Header. Designed for high-density applications, this vertical header features a sleek black finish and closed end option for added durability. With 144 circuits and a 2mm pitch, it ensures reliable performance in demanding environments. The phosphor bronze contacts with gold plating offer excellent conductivity, while the high-temperature thermoplastic construction can withstand temperatures ranging from -55°C to 105°C. Whether for mezzanine or backplane configurations, this header is stackable and surface mount compatible, making it a versatile choice for your PCB assembly needs. Rest assured, it meets RoHS compliance standards, guaranteeing both quality and environmental responsibility. Elevate your connectivity solutions with this essential component.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/18/2025 | 516838 - Equipment Transfer, Production Transfer or Rearrangement. equipment transfer that have been used to manufacture impacted part(s). No changes will be made to product as part of this change. | Download | |||
| 09/20/2022 | 512191 - Packaging Method/Quantity Changing. Molex will replace the top locked cartons with normal standard cartons. Carton size / packaging quantity and packaging materials remain unchanged. No changes will be made to the part design and will not affect the use or disposal of inventory. | Download | |||

