| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 73942-6200 |
| Color: | Black, Natural |
| Series: | 73942 - HDM |
| Amperage: | 1 A |
| Connector Type: | HDM |
| Number of Contacts: | 72 |
| Number of Rows: | 6 |
| Termination Method: | Through Hole |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 105 °C |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 2 mm |
| Voltage: | 250 VAC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | Open Pin Field |
| Data Rate: | 1 Gb/s |
| Tail Length: | 3.5 mm |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 72 |
| Mating Cycles: | 250 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 2.5 mm |
| Number of Columns: | 12 |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 040 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Termination Pitch: | 2 mm |
| Guide to Mating Part: | No |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0739426200 |
| SKU: | MOL73942-6200 |
73942-6200
Specifications
Detailed Description
Enhance your PCB connectivity with our HDM Board-to-Board Backplane Header. Designed for vertical orientation and featuring solder tail termination, this component ensures secure, reliable connections in high-density applications. With 72 gold-plated contacts, it guarantees excellent signal integrity, while its high-temperature thermoplastic construction offers durability in harsh environments. RoHS compliant and suitable for lead-free soldering processes, this header is a versatile and eco-friendly solution for your connectivity needs. Perfect for backplane configurations, it allows for efficient data transfer at up to 1 Gb/s, making it ideal for a wide range of industrial and commercial applications. Trust in the quality and performance of this essential connector for your next project.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/18/2025 | 516838 - Equipment Transfer, Production Transfer or Rearrangement. equipment transfer that have been used to manufacture impacted part(s). No changes will be made to product as part of this change. | Download | |||
| 09/20/2022 | 512191 - Packaging Method/Quantity Changing. Molex will replace the top locked cartons with normal standard cartons. Carton size / packaging quantity and packaging materials remain unchanged. No changes will be made to the part design and will not affect the use or disposal of inventory. | Download | |||

