74099-0605

Heilind Number:	MOL74099-0605
Manufacturer:	Molex
Manufacturer Number:	74099-0605
Datasheet:	Packaging Specifications
ECAD Model:

Description:

SL Wire-to-Board Header, Surface Mount, Single Row, Vertical, 5 Circuits, Tin (Sn) Plating, Packaging Tape and Reel with Pick-and-Place Cap

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Specifications

Attribute	Value
Product Category:	PC Board Pin & Receptacle Connectors PCB Pin Headers
Manufacturer:	Molex
Manufacturer Part Number:	Molex 74099-0605
Color:	Black
Series:	74099
Amperage:	3 A
Connector Type:	SL
Number of Contacts:	5
Number of Rows:	1
Termination Method:	Surface Mount
Contact Material:	Phosphor Bronze
Body Orientation:	Straight
Pitch:	2.54 mm
Voltage:	250 V
Material:	High Temperature Thermoplastic
Orientation:	Vertical
Operating Temperature Range:	-40 - 105 °C
Contact Mating Area Plating:	Tin
Contact Mating Area Plating Thickness:	3.81 µm
Number of Contacts Loaded:	5
Mating Cycles:	25
Contact Termination Plating Thickness:	3.81 µm
Polarized to Mate:	Yes
PCB Thickness (Recommended):	1.57 mm
Connector System:	Wire to Board
Contact Termination Plating:	Tin
Maximum Solder Process Temperature:	245 °C
Lead Free Process Capability:	REFLOW
Duration at Max. Process Temperature (seconds):	040
Max. Cycles at Max. Process Temperature:	003
Glow Wire Capable:	No
Surface Mount Compatible:	Yes
Breakaway:	No
Shroud Type:	Fully
Product Name:	SL
Material Flammability Standard:	94V-0
Part Aliases:	0740990605
SKU:	MOL74099-0605

Detailed Description

Enhance your PCB connectivity with our SL Wire-to-Board Header. Designed for surface mount installation, this single-row connector features five circuits with tin plating for optimal conductivity. The packaging includes convenient tape and reel with a Pick-and-Place cap for efficient assembly. Operating at 250V and 3A, it ensures reliable power transmission. Crafted from high temperature thermoplastic, it withstands temperatures ranging from -40 to 105°C. With phosphor bronze contacts and a pitch of 2.54mm, it guarantees secure and durable connections. Fully RoHS compliant, it meets international standards for environmental responsibility, making it the perfect choice for your electronic projects.

Product Change Notice

Effective Date	Description of Change	Download
12/30/2022	511846 - Capacity change or tool replacement Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform about new die tooling fabricate in Malaysia is being added to meet the current and future demands of this product referenced below. This notification also add additional manufacturing location for Unity pin Series. The reason for the change is to secure the supply of Bandolier pin for Molex Malaysia.	Download
08/31/2022	511584 - Change Supplier. This notification is to inform you about addition of 899922394 resin (Grade Name: SK Chemicals Skypura 7121F Black) as additional source for 70536 Series. The main reason to add 899922394 resin is to assure the supply of 70536 Series. No changes will be made to product as part of this change.	Download
11/23/2020	509053 - Equipment Transfer, Production Transfer or Rearrangement. Molex will relocate production of the SL and C-Grid Product lines from the US & MX to the Molex Malaysia Production facility transfer will start in 2020 and target completion is 2021 buffer stock and capacity tooling will be built as needed to ensure a seamless transition.	Download
06/10/2014	GCM 10640065 - Change In Packaging Specifications. The purpose of this letter is to inform you that Molex is planning to change the orientation of the SL SMT headers in reel pockets on the below part numbers: 740990626, 740990606, 740990605, 740990604, 740990603. The reason for this change is to correct the packing wind direction.	Download