| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 74671-1001 |
| Color: | Black |
| Series: | 74671 - VHDM-HSD |
| Amperage: | 1 A |
| Connector Type: | VHDM-HSD |
| Number of Rows: | 5 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | Copper-Nickel-Silicon, High Performance Alloy (HPA) |
| Pitch: | 2 mm |
| Voltage: | 120 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | PCB Receptacle |
| Number of Pairs: | Open Pin Field |
| Data Rate: | 5 Gb/s |
| Tail Length: | 2.8 mm |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 4 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Without |
| Polarized to PCB: | Yes |
| Number of Columns: | 1 |
| Contact Termination Plating: | Tin |
| Guide to Mating Part: | No |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Daughtercard |
| Make First / Break Last: | No |
| Part Aliases: | 0746711001 |
| SKU: | MOL74671-1001 |
74671-1001
| Heilind Number: | MOL74671-1001 |
| Manufacturer: | Molex |
| Manufacturer Number: | 74671-1001 |
| Datasheet: | Datasheet |
| ECAD Model: |
Description:
VHDM-HSD Optimized for differential backplane applications delivering data rates up to 5 Gbps. Modular construction enables design flexibility. Wafer receptacle, Right-Angle, 5-Row, Lead-free (Series:74670)
More >>Specifications
Detailed Description
Optimized for high-speed data transmission in differential backplane applications, this VHDM-HSD connector offers exceptional performance with data rates up to 5 Gbps. Featuring a modular design for enhanced flexibility in assembly, it is a versatile solution for demanding connectivity needs. The right-angle orientation and through-hole termination method ensure secure and reliable connections on the PCB. With a rugged construction and high-temperature thermoplastic material, it is built to withstand harsh operating environments. Gold-plated contact mating areas and a tin-plated termination enhance signal integrity, while the lead-free design aligns with environmental standards. With stackable and surface-mount compatibility, this connector is ideal for use in various board-to-board configurations, making it a valuable component in backplane connectors and accessories.

