75341-3333

Heilind Number:MOL75341-3333
Manufacturer:Molex
Manufacturer Number:75341-3333
Datasheet:Drawing
ECAD Model:
3D Model

Description:

GbX 4 Pair Backplane Connector System, Power Module, 8 Circuits, 1.27µm Gold (Au)

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 75341-3333
Color:Gray
Series:75341 - GbX
Amperage:6 A
Connector Type:GbX
Number of Contacts:8
Number of Rows:4
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Pitch:1.85 mm
Voltage:120 V AC/DC
Material:High Temperature Thermoplastic
Orientation:Vertical
Keying:No
Component Type:PCB Header
Number of Pairs:4
Data Rate:8 Gb/s
Tail Length:2.4 mm
Packaging:Tray
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:1.27 µm
Number of Contacts Loaded:8
Mating Cycles:200
PCB Locator:Yes
Shielded:No
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:.762 µm
PCB Thickness (Recommended):1.6 mm
UL Agency Certification:E29179
Contact Termination Plating:Tin
Termination Pitch:1.85 mm
Guide to Mating Part:No
Stackable:Yes
Surface Mount Compatible:Yes
Board to Board Configuration:Backplane
Make First / Break Last:Yes
Material Flammability Standard:94V-0
Part Aliases:0753413333
SKU:MOL75341-3333

Detailed Description

Enhance your power connectivity with our GbX 4 Pair Backplane Connector System, featuring a Power Module with 8 circuits. Designed for reliability, this system boasts high performance alloy contacts and 1.27µm Gold (Au) plating for efficient power transmission. With a 6A amperage and 120V AC/DC voltage rating, it ensures robust performance in demanding applications. The vertical orientation and through-hole termination method with compliant pins offer easy installation on PCBs. Each of the 8 contacts is loaded for maximum connectivity, and with a mating cycle of 200, durability is guaranteed. RoHS compliant and UL certified, this connector system meets industry standards for quality and safety, making it ideal for high-speed data transfer in backplane configurations.