75361-0031

Heilind Number:MOL75361-0031
Manufacturer:Molex
Manufacturer Number:75361-0031
Datasheet:Drawing
ECAD Model:
3D Model

Description:

GbX Daughtercard Wafer Module, 75 Circuits, Right-Angle, with Select Gold (Au) Plating 0.76µm, Lead-Free

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 75361-0031
Series:75361 - GbX
Amperage:1 A
Connector Type:GbX
Number of Contacts:75
Number of Rows:10
Termination Method:Through Hole - Compliant Pin
Contact Material:Copper Alloy
Pitch:1.85 mm
Voltage:120 V AC/DC
Material:High Temperature Thermoplastic
Orientation:Right Angle
Keying:No
Component Type:PCB Receptacle
Number of Pairs:5
Data Rate:8 Gb/s
Tail Length:2 mm
Packaging:Tube
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:75
Mating Cycles:200
PCB Locator:No
PCB Retention:Without
Polarized to PCB:Yes
Contact Termination Plating Thickness:.762 µm
PCB Thickness (Recommended):1.6 mm
Contact Termination Plating:Matte Tin
Termination Pitch:1.85 mm
Guide to Mating Part:No
Board to Board Configuration:Daughtercard
Part Aliases:0753610031
SKU:MOL75361-0031

Detailed Description

Introducing the GbX Daughtercard Wafer Module, a high-performance PCB receptacle designed for seamless connectivity in advanced electronic systems. With 75 gold-plated contacts and a right-angle orientation, this module ensures reliable signal transmission in compact spaces. Featuring a lead-free construction and compliant pin termination method, it meets stringent environmental standards without compromising on performance. Boasting a data rate of 8 Gb/s and a voltage rating of 120 V AC/DC, it's ideal for demanding applications. Its durable thermoplastic housing, along with matte tin termination plating, guarantees long-term durability. Whether in backplane connectors or board-to-board configurations, this module is a versatile solution for your connectivity needs.