| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 75586-0007 |
| Color: | Black |
| Series: | 75586 - iPass - Mini Multi-Lane - PCI Express |
| Amperage: | .5 A |
| Connector Type: | iPass, Mini Multi-Lane, PCI Express |
| Gender: | Female |
| Number of Contacts: | 68 |
| Number of Rows: | 2 |
| Termination Method: | Surface Mount |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | 8 mm |
| Voltage: | 30 V AC/DC |
| Material: | Thermoplastic |
| Number of Ports: | 1 |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | Receptacle |
| Operating Temperature Range: | -40 - 80 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 68 |
| Mating Cycles: | 250 |
| PCB Locator: | Yes |
| Shielded: | No |
| PCB Retention: | Without |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.35 mm |
| Supplier Product Group: | High Speed Cage & Connector Assemblies |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 020 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | .8 mm |
| Electrical Model: | Yes |
| Lock to Mating Part: | No |
| Surface Mount Compatible: | Yes |
| Waterproof Dustproof: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0755860007 |
| SKU: | MOL75586-0007 |
75586-0007
| Heilind Number: | MOL75586-0007 |
| Manufacturer: | Molex |
| Manufacturer Number: | 75586-0007 |
| Datasheet: | Product Specification |
| ECAD Model: |
Description:
0.80mm Pitch, iPass I/O Surface Mount Receptacle, Right-Angle, External Application, 68 Circuit, 0.76?m Gold (Au)
More >>Specifications
Detailed Description
Elevate your connectivity with our Mini Multi-Lane PCI Express Receptacle, designed for high-speed data transfer. This black, right-angle connector features a surface-mount termination method and 68 gold-plated contacts for optimal performance. With a compact .8mm pitch and operating temperature range of -40 to 80°C, it's ideal for demanding applications. RoHS compliant and lead-free process capable, it's a sustainable choice for your projects. Whether you're assembling wire-to-board systems or designing high-speed interfaces, this connector ensures reliable, efficient connections every time.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/14/2022 | 512019 - Change Supplier. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function. | Download | |||
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download | |||
| 07/24/2021 | 509389 - Equipment Transfer, Production Transfer or Rearrangement. Molex will add mfg source to run the parts of IPASS at local qualified assembly vendors, regardless of the location, production conditions will remain the same meaning the same component from the same source the same process monitoring system and the same quality control plan. | Download | |||
| 07/11/2021 | 510341 - Supplier Change. Due to Supply constraints, molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders, therefore an alternative sourcing has been identified for product families listed. current supplier: Polyplastics resin Trade/grade: LAPERIS E130I BK205P Alternative Supplier: Celanese resin trade/grade: VECTRA E130I BK211P | Download | |||
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download | |||
| 06/18/2016 | GCM 10731102 - Manufacturing Process Change. The purpose of this letter is to inform you that Molex Chengdu will change the date code marking method from current ink printing to laser marking with auto machine for iPass series products. All validation is in process and we are expecting to complete the changeover action in the end of Apr 2016. This will improve our product's quality performance and tractability. We thank you for choosing Molex products. | Download | |||
| 01/01/2016 | GCM 10692749 - Supplier Change. The purpose if this letter is to inform you that Molex CD resin supplier will change production site from Malaysia &Taiwan to Nantong, China due to supplier strategic consolidate. | Download | |||
| 10/29/2015 | GCM 10716327 - New, Modified, Or Replacement Tooling. Molex Chengdu will implement a new process change about using auto mylar machine to replace current manual way on 75586 auto line#3.This reason of this change is to improve the quality performance. | Download | |||

