| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 75651-0031 |
| Series: | 75651 - GbX |
| Amperage: | 1 A |
| Connector Type: | GbX |
| Number of Contacts: | 25 |
| Number of Rows: | 4 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | Copper Alloy |
| Pitch: | 1.85 mm |
| Voltage: | 120 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | PCB Receptacle |
| Number of Pairs: | 2 |
| Data Rate: | 8 Gb/s |
| Tail Length: | 2 mm |
| Packaging: | Tube |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 25 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | .762 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Contact Termination Plating: | Matte Tin |
| Termination Pitch: | 1.85 mm |
| Guide to Mating Part: | No |
| Board to Board Configuration: | Daughtercard |
| Part Aliases: | 0756510031 |
| SKU: | MOL75651-0031 |
75651-0031
Specifications
Detailed Description
Introducing the GbX Daughtercard Wafer Module, a high-performance connectivity solution designed for advanced PCB applications. With 25 circuits and a right-angle orientation, this module offers seamless integration into your system. Featuring Select Gold (Au) plating with a thickness of 0.76µm, it ensures reliable signal transmission with minimal risk of corrosion. The lead-free design prioritizes environmental sustainability, while the durable construction of high temperature thermoplastic guarantees longevity in operation. Ideal for demanding environments, this module is rated for 1A and 120V AC/DC, making it suitable for a wide range of industrial and commercial settings. Whether you're building complex electronic systems or upgrading existing infrastructure, the GbX Daughtercard Wafer Module delivers exceptional performance and durability.

