75671-0035

Heilind Number:MOL75671-0035
Manufacturer:Molex
Manufacturer Number:75671-0035
Datasheet:Tooling Manual
ECAD Model:
3D Model

Description:

GbX L-Series Daughtercard Wafer Module, 25 Circuits, Right-Angle, with Select Gold (Au) Plating 0.76µm, Lead-Free

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 75671-0035
Color:Gray (Dark)
Series:75671 - GbX
Amperage:1 A
Connector Type:GbX
Number of Contacts:25
Number of Rows:5
Termination Method:Through Hole - Compliant Pin
Contact Material:Copper-Nickel-Silicon
Pitch:1.85 mm
Voltage:120 V AC/DC
Material:High Temperature Thermoplastic
Orientation:Right Angle
Keying:No
Component Type:PCB Receptacle
Number of Pairs:2
Data Rate:8 Gb/s
Tail Length:2 mm
Packaging:Tube
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:25
Mating Cycles:200
PCB Locator:No
Shielded:No
PCB Retention:Without
Polarized to PCB:Yes
Contact Termination Plating Thickness:.762 µm
PCB Thickness (Recommended):1.6 mm
Number of Columns:8
Contact Termination Plating:Tin
Termination Pitch:1.85 mm
Guide to Mating Part:No
Stackable:Yes
Surface Mount Compatible:Yes
Board to Board Configuration:Daughtercard
Make First / Break Last:No
Part Aliases:0756710035
SKU:MOL75671-0035

Detailed Description

The GbX L-Series Daughtercard Wafer Module is a high-performance connectivity solution for your PCB needs. With 25 circuits and a right-angle orientation, it ensures efficient signal transmission. The module features Select Gold (Au) Plating for enhanced conductivity, while its lead-free construction meets environmental standards. In a sleek Gray (Dark) color, it blends seamlessly with your setup. Ideal for use in a variety of applications, this component is a reliable choice for achieving optimal performance in your electronic systems.