| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 75705-1604 |
| Color: | Black |
| Series: | 75705 - GbX I-Trac |
| Amperage: | 1 A |
| Connector Type: | GbX I-Trac |
| Number of Contacts: | 132 |
| Number of Rows: | 11 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 1.85 mm, 3.7 mm |
| Voltage: | 120 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | 6-pair, Open Pin Field |
| Data Rate: | 12 Gb/s |
| Tail Length: | 2.1 mm |
| Packaging: | Tray |
| Operating Temperature Range: | -55 - 80 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 132 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .762 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Number of Columns: | 6 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1 mm, 2.7 mm |
| Guide to Mating Part: | No |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane, Midplane, Orthogonal |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0757051604 |
| SKU: | MOL75705-1604 |
75705-1604
Specifications
Detailed Description
Enhance your PCB connectivity with the GbX I-Trac Vertical Header Module. Featuring a 1.85mm by 3.70mm Pitch design, this connector boasts 11 rows and 6 columns, accommodating a total of 132 circuits. Crafted for durability, it offers High Performance Alloy (HPA) contacts with Gold plating, ensuring reliable performance at voltages up to 120V AC/DC. With a mating pin length of 5.70mm and a tail length of 2.1mm, it's suitable for various applications. Operating seamlessly in temperatures ranging from -55 to 80°C, this connector is RoHS compliant and stackable, making it a versatile choice for backplane, orthogonal, or midplane board-to-board configurations. Elevate your interconnect solutions with this high-quality component.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/08/2025 | 516698 - Equipment Transfer, Production Transfer or Rearrangement. Molex Singapore is relocating the assembly machines as part of its business strategy plant as a result of the change there is no COO change as both Locations are located in Malaysia. | Download | |||
| 08/20/2021 | 509265 - Equipment Transfer, Production Transfer or Rearrangement. Molex will relocate ITRAC and ITRACE products and consolidate production and tooling to the operational management of molex Singapore no impact to fit form or function. | Download | |||

