| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 75705-1635 |
| Color: | Black |
| Series: | 75705 - GbX I-Trac |
| Amperage: | 1 A |
| Connector Type: | GbX I-Trac |
| Number of Contacts: | 132 |
| Number of Rows: | 11 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Pitch: | 1.85 mm, 3.7 mm |
| Voltage: | 120 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | 6, Open Pin Field |
| Data Rate: | 12 Gb/s |
| Tail Length: | 2.1 mm |
| Packaging: | Tray |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 132 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .762 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Number of Columns: | 6 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1 mm, 2.7 mm |
| Guide to Mating Part: | No |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane, Midplane, Orthogonal |
| Make First / Break Last: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0757051635 |
| SKU: | MOL75705-1635 |
75705-1635
| Heilind Number: | MOL75705-1635 |
| Manufacturer: | Molex |
| Manufacturer Number: | 75705-1635 |
| Datasheet: | RoHS Certificate of Compliance |
| ECAD Model: |
Description:
GbX I-Trac Vertical Header Module, 1.85mm by 3.70mm Pitch, Unguided, Right End Wall, 11 Rows, 6 Columns, 132 Circuits, Mating Pin Length 4.70mm and 5.70mm
More >>Specifications
Detailed Description
Enhance your PCB connectivity with the GbX I-Trac Vertical Header Module. Featuring a sleek black design, this component offers 132 circuits with a mating pin length of 4.70mm and 5.70mm. With 11 rows and 6 columns, it provides ample contact points for seamless integration. Made with high-performance alloy and high-temperature thermoplastic, it ensures durability and reliability. The 3.7mm pitch and 1.85mm pitch allow for efficient data transfer at up to 12 Gb/s, while the through-hole termination method guarantees secure attachment. Operating at 120 V AC/DC, this header module is suitable for various applications. RoHS compliant and with gold contact plating, it meets industry standards for environmental responsibility and performance. Perfect for backplane, orthogonal, and midplane configurations, it's a versatile solution for your connectivity needs.

