75705-1803

MOL75705-1803
Heilind Number:MOL75705-1803
Manufacturer:Molex
Manufacturer Number:75705-1803
Datasheet:Drawing
ECAD Model:
3D Model

Description:

GbX I-Trac Vertical Header Module, 1.85mm by 3.70mm Pitch, Unguided, Open Ends, 11 Rows, 8 Columns, 176 Circuits, Mating Pin Length 4.70mm

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Specifications

AttributeValue
Product Category:
Backplane Connectors & Accessories Backplane Connectors
Manufacturer:Molex
Manufacturer Part Number:Molex 75705-1803
Color:Black
Series:75705 - GbX I-Trac
Amperage:1 A
Connector Type:GbX I-Trac
Number of Contacts:176
Number of Rows:11
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Pitch:1.85 mm, 3.7 mm
Voltage:120 V AC/DC
Material:High Temperature Thermoplastic
Orientation:Vertical
Keying:No
Component Type:PCB Header
Number of Pairs:6, Open Pin Field
Data Rate:12 Gb/s
Tail Length:2.1 mm
Packaging:Tray
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:176
Mating Cycles:200
PCB Locator:No
Shielded:No
PCB Retention:Without
Polarized to PCB:No
Contact Termination Plating Thickness:.762 µm
PCB Thickness (Recommended):1.6 mm
Number of Columns:8
UL Agency Certification:E29179
Contact Termination Plating:Tin
Termination Pitch:1 mm, 2.7 mm
Guide to Mating Part:No
Stackable:Yes
Surface Mount Compatible:Yes
Board to Board Configuration:Backplane, Midplane, Orthogonal
Make First / Break Last:No
Material Flammability Standard:94V-0
Part Aliases:0757051803
SKU:MOL75705-1803

Detailed Description

Experience seamless connectivity with the GbX I-Trac Vertical Header Module. This high-performance component boasts a 1.85mm by 3.70mm pitch, featuring 11 rows and 8 columns for a total of 176 circuits. Crafted with precision, it ensures reliable power delivery with a 1A amperage rating and 120V AC/DC voltage support. The unguded design with open ends facilitates easy installation, while the durable construction with High Temperature Thermoplastic and High Performance Alloy (HPA) contact material guarantees longevity. Whether for backplane, orthogonal, or midplane board-to-board configurations, this connector, with gold-plated mating area contacts, offers optimal signal transmission at data rates up to 12 Gb/s. Trust in its robust design, stackable and surface-mount compatible, for a variety of applications in the most demanding environments. Rest assured of its quality, with E29179 UL agency certification, and compliance with RoHS standards. Elevate your connectivity solutions with this essential PCB header module.