| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 75705-3103 |
| Color: | Black |
| Series: | 75705 - GbX I-Trac |
| Amperage: | 1 A |
| Connector Type: | GbX I-Trac |
| Number of Contacts: | 220 |
| Number of Rows: | 11 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 1.85 mm, 3.7 mm |
| Voltage: | 120 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | 6-pair, Open Pin Field |
| Data Rate: | 12 Gb/s |
| Tail Length: | 2.1 mm |
| Operating Temperature Range: | -55 - 80 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 220 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .762 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Number of Columns: | 10 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1 mm, 2.7 mm |
| Guide to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane, Midplane, Orthogonal |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0757053103 |
| SKU: | MOL75705-3103 |
75705-3103
| Heilind Number: | MOL75705-3103 |
| Manufacturer: | Molex |
| Manufacturer Number: | 75705-3103 |
| Datasheet: | Product Specification |
| ECAD Model: |
Description:
GbX I-Trac Vertical Header Module, 1.85mm by 3.7mm Pitch, Left Guide, Right Open, 11 Rows, 10 Columns, 220 Circuits, Mating Pin Length 4.7mm
More >>Specifications
Detailed Description
Enhance your PCB connectivity with our GbX I-Trac Vertical Header Module, featuring a 1.85mm by 3.70mm pitch design. With left guide and right open configuration, it offers 11 rows and 10 columns for efficient circuitry organization. Boasting 220 high-performance alloy contacts with gold plating, it ensures reliable power transmission at up to 120V AC/DC and 1A. The through-hole termination method with compliant pins guarantees secure attachment to your board. Operating in extreme temperatures from -55 to 80°C, this module is ideal for demanding industrial environments. RoHS compliant and tray packaged, it meets stringent quality standards for your peace of mind. Elevate your connectivity with this essential component for backplane and midplane configurations.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/08/2025 | 516698 - Equipment Transfer, Production Transfer or Rearrangement. Molex Singapore is relocating the assembly machines as part of its business strategy plant as a result of the change there is no COO change as both Locations are located in Malaysia. | Download | |||
| 08/20/2021 | 509265 - Equipment Transfer, Production Transfer or Rearrangement. Molex will relocate ITRAC and ITRACE products and consolidate production and tooling to the operational management of molex Singapore no impact to fit form or function. | Download | |||
| 06/30/2020 | 508245 - Supplier Change. Establishing a new screw source for North America. | Download | |||

