| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 75705-5604 |
| Color: | Black |
| Series: | 75705 - GbX I-Trac |
| Amperage: | 1 A |
| Connector Type: | GbX I-Trac |
| Number of Contacts: | 132 |
| Number of Rows: | 11 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 1.85 mm, 3.7 mm |
| Voltage: | 120 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | 6-pair, Open Pin Field |
| Data Rate: | 12 Gb/s |
| Tail Length: | 2.1 mm |
| Packaging: | Tray |
| Operating Temperature Range: | -55 - 80 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 132 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .762 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Number of Columns: | 6 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1 mm, 2.7 mm |
| Guide to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane, Midplane, Orthogonal |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0757055604 |
| SKU: | MOL75705-5604 |
75705-5604
Specifications
Detailed Description
Enhance your PCB connectivity with the GbX I-Trac Vertical Header Module. Designed for optimal performance, this component features a 1.85mm by 3.70mm pitch, 11 rows, and 6 columns, providing a total of 132 circuits for seamless data transmission. With a mating pin length of 5.70mm and gold contact plating, it ensures reliable conductivity. The high-performance alloy (HPA) contact material and high-temperature thermoplastic construction guarantee durability in demanding environments. Suitable for a wide range of applications, this black-colored header module is RoHS compliant and operates at temperatures ranging from -55 to 80 °C. Whether used in backplane, orthogonal, or midplane configurations, it offers a data rate of 12 Gb/s, making it an essential component for high-speed connectivity. Trust in the GbX I-Trac Vertical Header Module for efficient and secure board-to-board connections.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/08/2025 | 516698 - Equipment Transfer, Production Transfer or Rearrangement. Molex Singapore is relocating the assembly machines as part of its business strategy plant as a result of the change there is no COO change as both Locations are located in Malaysia. | Download | |||

