| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 75705-5824 |
| Color: | Black |
| Series: | 75705 - GbX I-Trac |
| Amperage: | 1 A |
| Connector Type: | GbX I-Trac |
| Number of Contacts: | 176 |
| Number of Rows: | 11 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Pitch: | 1.85 mm, 3.7 mm |
| Voltage: | 120 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | Yes |
| Component Type: | PCB Header |
| Number of Pairs: | 6-pair, Open Pin Field |
| Data Rate: | 12 Gb/s |
| Tail Length: | 2.1 mm |
| Packaging: | Tray |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 176 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .762 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Number of Columns: | 8 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1 mm, 2.7 mm |
| Guide to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane, Midplane, Orthogonal |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0757055824 |
| SKU: | MOL75705-5824 |
75705-5824
Specifications
Detailed Description
Enhance your PCB connectivity with the GbX I-Trac Vertical Header Module. Featuring a 1.85mm by 3.70mm pitch and a sleek black design, this module boasts 11 rows and 8 columns for a total of 176 circuits. With a mating pin length of 5.70mm and key orientation B, it ensures secure and efficient connections. Made from high-performance alloy, it guarantees durability and reliability. Suitable for 6-pair configurations with a data rate of 12 Gb/s, it is perfect for high-speed applications. RoHS compliant and featuring gold plating in the contact mating area, it meets stringent quality standards. Whether for backplane, orthogonal, or midplane setups, this module is an essential component for your electronic projects.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/08/2025 | 516698 - Equipment Transfer, Production Transfer or Rearrangement. Molex Singapore is relocating the assembly machines as part of its business strategy plant as a result of the change there is no COO change as both Locations are located in Malaysia. | Download | |||

