| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 75710-1006 |
| Color: | Black |
| Series: | 75710 - GbX I-Trac |
| Amperage: | 1 A |
| Connector Type: | GbX I-Trac |
| Number of Contacts: | 132 |
| Number of Rows: | 11 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Minimum Operating Temperature: | -55 °C |
| Body Orientation: | Right Angle |
| Pitch: | 1.85 mm, 3.7 mm |
| Voltage: | 120 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | PCB Receptacle |
| Number of Pairs: | Open Pin Field |
| Data Rate: | 12 Gb/s |
| Tail Length: | 2 mm |
| Packaging: | Tray |
| Operating Temperature Range: | -55 - 80 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 132 |
| Mating Cycles: | 200 |
| PCB Locator: | Yes |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .762 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Number of Columns: | 6 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1 mm, 2.7 mm |
| Guide to Mating Part: | No |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Coplanar, Daughtercard |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0757101006 |
| SKU: | MOL75710-1006 |
75710-1006
Specifications
Detailed Description
Introducing the GbX I-Trac Right-Angle Daughtercard Module, designed for high-speed connectivity in electronic systems. With a compact 1.85mm by 3.70mm pitch, this module features 11 rows and 6 columns, accommodating a total of 132 circuits. Crafted with precision, it ensures reliable performance with a current rating of 1A and voltage support up to 120V AC/DC. The contact material is High Performance Alloy (HPA) with gold plating, offering excellent conductivity. Suitable for through-hole mounting, this module is ideal for PCB receptacle applications. Its robust construction, operating in a wide temperature range from -55°C to 80°C, guarantees durability in diverse environments. RoHS compliant and UL certified, it meets stringent quality standards for peace of mind. Perfect for backplane and board-to-board configurations, this module is a versatile solution for demanding connectivity needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/08/2025 | 516698 - Equipment Transfer, Production Transfer or Rearrangement. Molex Singapore is relocating the assembly machines as part of its business strategy plant as a result of the change there is no COO change as both Locations are located in Malaysia. | Download | |||
Availability
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Minimum/Multiple:
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 75710-1006 |
| Other Names: | 0757101006 |