| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 75710-1008 |
| Color: | Black |
| Series: | 75710 - GbX I-Trac |
| Amperage: | 1 A |
| Connector Type: | GbX I-Trac |
| Number of Contacts: | 176 |
| Number of Rows: | 11 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Minimum Operating Temperature: | -55 °C |
| Body Orientation: | Right Angle |
| Pitch: | 1.85 mm, 3.7 mm |
| Voltage: | 120 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | PCB Receptacle |
| Number of Pairs: | Open Pin Field |
| Data Rate: | 12 Gb/s |
| Tail Length: | 2 mm |
| Packaging: | Tray |
| Operating Temperature Range: | -55 - 80 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 176 |
| Mating Cycles: | 200 |
| PCB Locator: | Yes |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .762 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Number of Columns: | 8 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1 mm, 2.7 mm |
| Guide to Mating Part: | No |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Coplanar, Daughtercard |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0757101008 |
| SKU: | MOL75710-1008 |
75710-1008
| Heilind Number: | MOL75710-1008 |
| Manufacturer: | Molex |
| Manufacturer Number: | 75710-1008 |
| Datasheet: | 3D Drawing |
| ECAD Model: |
Description:
GbX I-Trac Right-Angle Daughtercard Module, 1.85mm by 3.70mm Pitch, Unguided, 11 Rows, 8 Columns, 176 Circuits
More >>Specifications
Detailed Description
Enhance your connectivity with the GbX I-Trac Right-Angle Daughtercard Module. This high-performance component boasts a compact 1.85mm by 3.70mm pitch, featuring 11 rows and 8 columns for a total of 176 circuits. Crafted with precision, it ensures reliable data transmission at up to 12 Gb/s, making it ideal for high-speed applications. The module's through-hole termination method with compliant pins guarantees secure and durable attachment to your PCB. With a wide operating temperature range of -55 to 80 °C and RoHS compliance, it meets stringent quality standards for versatility and environmental responsibility. Upgrade your electronics with this essential component, designed for seamless integration into your systems.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/08/2025 | 516698 - Equipment Transfer, Production Transfer or Rearrangement. Molex Singapore is relocating the assembly machines as part of its business strategy plant as a result of the change there is no COO change as both Locations are located in Malaysia. | Download | |||
| 08/20/2021 | 509265 - Equipment Transfer, Production Transfer or Rearrangement. Molex will relocate ITRAC and ITRACE products and consolidate production and tooling to the operational management of molex Singapore no impact to fit form or function. | Download | |||
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download | |||
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download | |||

