| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 75710-1010 |
| Color: | Black |
| Series: | 75710 - GbX I-Trac |
| Amperage: | 1 A |
| Connector Type: | GbX I-Trac |
| Number of Contacts: | 220 |
| Number of Rows: | 11 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Minimum Operating Temperature: | -55 °C |
| Body Orientation: | Right Angle |
| Pitch: | 1.85 mm, 3.7 mm |
| Voltage: | 120 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | PCB Receptacle |
| Number of Pairs: | Open Pin Field |
| Data Rate: | 12 Gb/s |
| Tail Length: | 2 mm |
| Packaging: | Tray |
| Operating Temperature Range: | -55 - 80 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 220 |
| Mating Cycles: | 200 |
| PCB Locator: | Yes |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .762 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Number of Columns: | 10 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1 mm, 2.7 mm |
| Guide to Mating Part: | No |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Coplanar, Daughtercard |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0757101010 |
| SKU: | MOL75710-1010 |
75710-1010
| Heilind Number: | MOL75710-1010 |
| Manufacturer: | Molex |
| Manufacturer Number: | 75710-1010 |
| Datasheet: | Product Specification |
| ECAD Model: |
Description:
GbX I-Trac Right-Angle Daughtercard Module, 1.85mm by 3.70mm Pitch, Unguided, 11 Rows, 10 Columns, 220 Circuits
More >>Specifications
Detailed Description
Enhance your connectivity with the GbX I-Trac Right-Angle Daughtercard Module, boasting a 1.85mm by 3.70mm pitch for precision. Featuring 11 rows and 10 columns with a total of 220 circuits, this module offers seamless integration onto your PCB. Crafted with High Performance Alloy (HPA) contacts and gold plating, it ensures reliable performance even in demanding environments. The through-hole termination method with compliant pins guarantees secure attachment, while the 12 Gb/s data rate capability meets high-speed transmission needs. Operating efficiently in a wide temperature range from -55 to 80°C, this module is RoHS compliant, aligning with environmental standards. Suitable for coplanar and daughtercard configurations, it's a versatile solution for your connectivity requirements.

