| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 75710-5006 |
| Color: | Black |
| Series: | 75710 - GbX I-Trac |
| Amperage: | 1 A |
| Connector Type: | GbX I-Trac |
| Number of Contacts: | 132 |
| Number of Rows: | 11 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Minimum Operating Temperature: | -55 °C |
| Body Orientation: | Right Angle |
| Pitch: | 1.85 mm, 3.7 mm |
| Voltage: | 120 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | PCB Receptacle |
| Number of Pairs: | Open Pin Field |
| Data Rate: | 12 Gb/s |
| Tail Length: | 2 mm |
| Packaging: | Tray |
| Operating Temperature Range: | -55 - 80 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 132 |
| Mating Cycles: | 200 |
| PCB Locator: | Yes |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | .762 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Number of Columns: | 6 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1 mm, 2.7 mm |
| Guide to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Coplanar, Daughtercard |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0757105006 |
| SKU: | MOL75710-5006 |
75710-5006
| Heilind Number: | MOL75710-5006 |
| Manufacturer: | Molex |
| Manufacturer Number: | 75710-5006 |
| Datasheet: | Product Specification |
| ECAD Model: | |
Description:
GbX I-Trac Right-Angle Daughtercard Module, 1.85mm by 3.70mm Pitch, Right Guide, 11 Rows, 6 Columns, 132 Circuits
More >>Specifications
Detailed Description
Enhance connectivity in your PCB assembly with the GbX I-Trac Right-Angle Daughtercard Module. With a compact 1.85mm by 3.70mm pitch and 11 rows by 6 columns configuration, this module offers seamless integration for high-density circuitry. Featuring 132 gold-plated contacts, it ensures reliable signal transmission at up to 12 Gb/s data rates. The robust construction, with High Performance Alloy (HPA) contacts and high-temperature thermoplastic housing, guarantees durability in extreme operating conditions ranging from -55 to 80°C. With through-hole termination and PCB locator for secure mounting, this black-colored module is RoHS compliant, making it an eco-friendly and dependable choice for your connectivity needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/08/2025 | 516698 - Equipment Transfer, Production Transfer or Rearrangement. Molex Singapore is relocating the assembly machines as part of its business strategy plant as a result of the change there is no COO change as both Locations are located in Malaysia. | Download | |||
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Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 75710-5006 |
| Other Names: | 0757105006 |