| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 75783-0110 |
| Color: | Black |
| Pitch: | 8 mm |
| Gender: | Female |
| Keying: | Yes |
| Series: | 75783 - iPass - Mini Multi-Lane - PCI Express |
| Voltage: | 30 V AC/DC |
| Amperage: | .5 A |
| Material: | Thermoplastic |
| Orientation: | Right Angle |
| PCB Locator: | Yes |
| Tail Length: | 1.96 mm |
| Mating Cycles: | 50 |
| PCB Retention: | Yes |
| PCB Thickness (Recommended): | 1.57 mm |
| Component Type: | Receptacle |
| Connector Type: | iPass, Mini Multi-Lane, PCI Express |
| Number of Rows: | 2 |
| Contact Plating: | Gold |
| Ground to Panel / PCB: | No |
| Number of Ports: | 1 |
| Body Orientation: | Right Angle |
| Connector System: | Wire to Board |
| Contact Material: | Copper-Nickel-Zinc, High Performance Alloy (HPA) |
| Electrical Model: | Yes |
| Polarized to Mate: | Yes |
| Termination Pitch: | .8 mm |
| Number of Contacts: | 36 |
| Termination Method: | Surface Mount and Through Hole |
| Lock to Mating Part: | No |
| Waterproof Dustproof: | No |
| Supplier Product Group: | High Speed Cage & Connector Assemblies |
| Surface Mount Compatible: | Yes |
| Number of Contacts Loaded: | 36 |
| Contact Mating Area Plating: | Gold |
| Contact Termination Plating: | Tin |
| Operating Temperature Range: | -40 - 80 °C |
| Lead Free Process Capability: | REFLOW |
| Contact Mating Area Plating Thickness: | .381 µm |
| Contact Termination Plating Thickness: | 2.540 µm |
| Maximum Solder Process Temperature: | 260 °C |
| Part Aliases: | 75783-0110 0757830110 |
| Material Flammability Standard: | 94V-0 |
| SKU: | MOL75783-0110 |
75783-0110
| Heilind Number: | MOL75783-0110 |
| Manufacturer: | Molex |
| Manufacturer Number: | 75783-0110 |
| Datasheet: | Datasheet |
| ECAD Model: |
Description:
iPass I/O Surface Mount Receptacle, Right-Angle, Internal Assembly with Shell, 36 Circuit, 0.38µm Gold (Au), Surface Mount Option, Tail Length 1.96mm, Left Key
Specifications
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 02/28/2023 | 511683REV1 - Obsolete. no replacement LTB: 11/28/22 LTS: 2/28/23 | Download | |||
| 06/18/2016 | GCM 10731102 - Manufacturing Process Change. The purpose of this letter is to inform you that Molex Chengdu will change the date code marking method from current ink printing to laser marking with auto machine for iPass series products. All validation is in process and we are expecting to complete the changeover action in the end of Apr 2016. This will improve our product's quality performance and tractability. We thank you for choosing Molex products. | Download | |||
| 01/01/2016 | GCM 10692749 - Supplier Change. The purpose if this letter is to inform you that Molex CD resin supplier will change production site from Malaysia &Taiwan to Nantong, China due to supplier strategic consolidate. | Download | |||
| 12/15/2015 | GCM 10715564 - Supplier Changes To Raw Material. This notification is to advise you of a change in supplier for the Nickel Silver base material used to make some components in some of Molex's products. The biggest users are cage components. Only the supplier will be changing, the type of the material will stay the same so there will be no impact to the form, fit, or function of the part. This change is needed because the current supplier is no longer offering the base material being used today. This will be a running change and will not affect the connector portion of the finished part. | Download | |||

