| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 76015-1103 |
| Color: | Black |
| Series: | 76015 - GbX I-Trac |
| Amperage: | 1 A |
| Connector Type: | GbX I-Trac |
| Number of Contacts: | 140 |
| Number of Rows: | 7 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 85 °C |
| Pitch: | 1.85 mm, 3.7 mm |
| Voltage: | 120 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | 4-pair, Open Pin Field |
| Data Rate: | 12 Gb/s |
| Tail Length: | 2.1 mm |
| Packaging: | Tray |
| Operating Temperature Range: | 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 140 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .762 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Number of Columns: | 10 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1 mm, 2.7 mm |
| Guide to Mating Part: | No |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane, Midplane, Orthogonal |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0760151103 |
| SKU: | MOL76015-1103 |
76015-1103
| Heilind Number: | MOL76015-1103 |
| Manufacturer: | Molex |
| Manufacturer Number: | 76015-1103 |
| Datasheet: | 3D Drawing |
| ECAD Model: |
Description:
GbX I-Trac Vertical Header Module, 1.85mm by 3.70mm Pitch, Unguided, Open Ends, 7 Rows, 10 Columns, 140 Circuits, Mating Pin Length 4.70mm
More >>Specifications
Detailed Description
Enhance your PCB connections with the GbX I-Trac Vertical Header Module, featuring a 1.85mm by 3.70mm pitch for precise alignment. This unguided connector boasts open ends, 7 rows, and 10 columns, accommodating 140 circuits with a mating pin length of 4.70mm. Crafted with high-performance alloy (HPA) contacts and gold plating, it ensures reliable conductivity at 1 A and 120 V AC/DC. Operating at temperatures up to 85°C, this component is ideal for high-speed applications, offering 12 Gb/s data rate capability. With through-hole termination and tray packaging, installation is convenient, while its stackable and surface-mount compatible design allows for versatile board-to-board configurations. RoHS compliant and UL agency certified, it guarantees both environmental sustainability and quality assurance, making it a top choice for backplane connectors and accessories. Elevate your connectivity solutions with the GbX I-Trac Vertical Header Module.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/08/2025 | 516698 - Equipment Transfer, Production Transfer or Rearrangement. Molex Singapore is relocating the assembly machines as part of its business strategy plant as a result of the change there is no COO change as both Locations are located in Malaysia. | Download | |||

